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Engineers Nominated by the Chinese Institute of Engineers (CIE)-USA
Chi Kong Cheung Cheung also has been involved in developing a tall copper bump process for flip-chip application. He has won two Northrop Grumman Space Technology Trade Secret Awards and received Northrop Grumman Space Technology’s highest award, the Award for Innovation, in 2007. Aaron Gin, Ph.D. As a CINT scientist at one of the five U.S. Nanoscale Science Research Centers, Dr. Gin interacts with a variety of users from academia and industry. He leverages his knowledge and resources to help accelerate their nanoscience efforts. In his research, Dr. Gin uses semiconductor cleanroom tools such as electron beam lithography to realize the nanofabrication of structures such as nanopillar lasers, infrared detectors, and plasmonic structures for applications in chem-bio sensing and high-speed computing. Dr. Gin’s background includes III-IV semiconductor material growth, as well as expertise in optoelectronic device fabrication and characterization. His doctoral work at Northwestern University included the first demonstration of an infrared nanopillar array detector in III-IV materials. Dr. Gin has made significant contributions in the field of nanofabrication, including several recent journal articles on the realization of DNA nanoarrays using lithography techniques and has more than 20 publications overall. He is also the co-author of a patent introducing new ideas in the area of Type II InAs/GaSb infrared detectors. Kou-Ruey Liu Prior to his current position, Liu worked as a structural engineer under the product quality improvement (PQI) project of a petroleum factory in Bangkok, Thailand. The PQI project effectively raised the quality and quantity of product in the petroleum industry, without causing vast waste of materials or severe construction pollution. Liu then assisted the dedicated senior design team in solving difficult design issues arising from the fact that the project’s structures and facilities are located near the downtown area of Bangkok. Liu also served as a second lieutenant in the army, during which time he focused on village reconstruction for military dependents. He negotiated with the architects, builders, and governmental organizations to ensure that the new buildings were of good quality and to facilitate the families’ transition into their new homes. « BACK |
Chi Kong Cheung, a process engineer at Northrop Grumman Corporation in Redondo Beach, California, works in the Microelectronics Center, where his initial assignment focused on photo-lithography processes for the fabrication of III-IV compound semiconductor MMICs. This has been followed by important work on a revolutionary wafer-level-packaging technology, where he has helped to develop an intercavity interconnect process that allows wafers to be stacked vertically. This technology will result in dramatic reductions in packaged MMIC volume and weight.
Aaron Gin, Ph.D., is a researcher at Sandia National Laboratories and the Center for Integrated Nanotechnologies (CINT) in Albuquerque, New Mexico. Dr. Gin designs, fabricates, and tests structures and devices on the nanometer scale (one nanometer is one billionth of a meter). His research interests include implementing novel nanoscale elements into lasers, light-emitting diodes, and detectors. Additions such as quantum dots, nanowires, or subwavelength gratings can dramatically affect the performance of such devices.
Kou-Ruey Liu, an engineer with CTCI Corporation in Taipei, Taiwan, R.O.C., is the key member of a newly established Innovation Team that is developing a pioneering concept of engineering design based on the time-saving requirement of the EPC industrial. He led the team to create an essential model of engineering design flow and reach a practical solution for complicated cross-field design, by which 33% of the total engineering duration would be saved.
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National Engineers Week Foundation
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